About me
I’m currently studying at Huazhong University of Science and Technology, under the supervision of Prof. Xiang Bai. My current research interests are mainly in Multi-modal Large Language Models (MLLMs), embodied AI, and 3D vision. I work closely with Dingkang Liang at HUST VLRLab.
🔍 Research Interests
- 3D Multimodal Large Language Models (3D MLLMs)
- Embodied AI
- 3D Vision
🔥 News
- [2025/11/8] 🎉 One paper is accepted by AAAI2026 as oral presentation!
- [2024/4/20] Open personal website.
📝 Publicaitons
* Equal Contribution, † Corresponding Author

Cook and Clean Together: Teaching Embodied Agents for Parallel Task Execution
AAAI 2026 (oral)
Dingkang Liang*, Cheng Zhang*, Xiaopeng Xu, Jianzhong Ju, Zhenbo Luo, Xiang Bai
Introduces a new task that challenges agents to generate efficient, 3D grounded action schedules guided by operations research principles.






See full publication list on Google Scholar ->
📘 Research Experience
VLRLab, Huazhong University of Science and Technology, Wuhan
Member
- Advisor: Xiang Bai
- Research Topics: 3D Multimodal Large Language Models, Embodied AI
National Engineering Research Center for E-Learning, Central China Normal University, Wuhan
Research Assistant
- Advisor: Hai Liu
- Research Topics: Head Pose Estimation, Fine-grained Image Classification, Facial Expression Recognition
🏅 Honors and Awards
Graduate Academic First-Class Scholarship, 10,000RMB
Huazhong University of Science and Technology
National Scholarship (Top 0.2%, Undergraduate), 10,000RMB
Central China Normal University
Patents
📖 Educations
Huazhong University of Science and Technology
Graduate Student, Pursuing Master’s degree in Software Engineering
- Supervised by Prof. Xiang Bai
Central China Normal University
Bachelor of Engineering in Artificial Intelligence
- Supervised by Prof. Hai Liu
IELTS: 7.5
Listening-8.0; Speaking-6.0; Reading-8.5; Writing-6.5
GRE: 324
Verbal-155; Quantitative-169; Analytical Writing-3.0
CET 6
Overall-587
🎓 Academic Service
Reviewer: NeurIPS 2024, AISTATS 2025, ICML 2025, AAAI 2026, ICLR 2026
💼 Internship
I am now available on the job market.

DBLP
CSDN
Substack